Title: Recent Development of Room Temperature Bonding usingthe Surface Activation Method

　  Speaker: Prof. Dr. Tadatomo Suga (University of Tokyo, Japan)

　  Time: 9:00am, Dec.5,2012

　  Venue: Salon Room, Institute of Semiconductors, CAS

　 Abstract:Various bonding techniques are used for semiconductor 3D integration, and microsystem & MEMS packaging, which include oxide bonding, anodic bonding, glass frit bonding, soldering, eutectic bonding, metal diffusion bonding, ultrasonic bonding, adhesive joint, and so on. However, these conventional bonding methods in general require high-temperature annealing to achieve high bonding strength. The high temperature requiredin such bonding processes is a major drawback of the conventional bonding methods because it degrades the device reliability and manufacturing yield, especially in heterogeneous integration of dissimilar materials. Therefore, low temperature bonding and interconnection technologies are highly desirable especially for heterogeneous integration for 3D applications. The surface activated bonding (SAB), which has been applied successfully to bond metals, Si, and III-V semiconductors at room temperature, has attracted increasing interest due to its simple process flow, no need for additional materials for bonding, and compatibility with CMOS technology. The SAB method has been applied already also in volume production such as SAW devices, metal laminates, and MEMS packaging. I will reviews the SAB method in terms of the history and the state of the art as well as the future out look.

　 Biography：Prof. Tadatomo SUGA received M.S. from the University of Tokyo in 1979. He joined the Max-Planck Institut für Metallforschung, Stuttgart, in 1979, and received Ph.D. from University of Stuttgart in 1983 for his study on fracture mechanics characterization of metal-ceramic interfaces. In 1984 he became a member of Faculty of Engineering, the University of Tokyo, and since 1993, he has been a professor at the Department of Precision Engineering of the School of Engineering. He conducted also a research group in National Institute of Materials Science (NIMS) as a director from 2002-2009, and chaired IEEE CPMT Society Japan Chapter from 2007-2009. He was appointed as the 20th council members of the Science Council of Japan (SCJ) and the 21th associate member of SCJ. His researches focus on micro-systems integration and packaging..