Abstract:High quality, high reliability, lower cost, and time-to-market are the key elements to win the worldwide products competition. To achieve the above- mentioned goal, significantly reduces the design cycle, increases reliability and performance/cost ratio become the critical issue for product development. Facing the drastically worldwide competition, design-on-simulation technology, e.g. 10X development procedure (reduce the design cycle by 10 times) using Design-on-Simulation (DoS) technology, was adopted for more than 10 years by many companies and research centers to meet the high quality, low cost and time-to-market demands. To reach this target, the high-performance computing and simulation methods were intensively used as the main technology for the 10X design concept, therefore, computer hardware, software and with a well experienced research team in simulation technology and domain knowledge are very important for this 10X design/development procedure. The R&D leader and team members with strong fundamental theories and knowledge/experience in the manufacturing processes are critically needed to ensure the success of this novel design procedure.
The 176th:The Impact of Design-on-Simulation Technology on Mcroelectronics Product Design Procedure
Date:
From:14:00pm, Sept. 18, 2012
Title:The Impact of Design-on-Simulation Technology on Mcroelectronics Product Design Procedure
Speaker: Prof. Guoning Jiang( Center for High-Performance Computing, Taiwan )
Time:14:00pm, Sept. 18, 2012
Venue: Academic conference center, Institute of Semiconductors, CAS
Speaker:Professor Chiang is the Editor-in-Chief of IEEE Transactions on Components, Packaging and Manufacturing Technology, and he was the associate editor of 4 SCI Journals, IEEE Transactions, Components and Packaging Technologies as well as Advanced Packaging, ASME Transactions – Journal of Electronic Packaging and Journal of Mechanics. His vision and research performance drives to establish a “Design on Simulation (DOS)” based development procedure for advanced packaging products such as WLCSP and 3D packages, he is a well-known scholar in this research and application field. Professor Chiang has collaborated with many electronic packaging house, semiconductor and LED companies such as ACET, tsmc, UMC, EPISTAR (LED), VIA, etc. Between 2006-2012, professor Chiang was the Chairman of Taiwan Microelectronics and Packaging Society and also President of IMAPS – Taiwan. Currently, he is the director of Advanced Packaging Research Center, National Tsing Hua University and also the director general of Center for High-Performance Computing (NCHC) of Taiwan.