Title:Patternable Low-κ Dielectric Materials for “Greener” Semiconductor Manufacturing

Speaker: Prof. Qinghuang Lin（IBM Thomas J. Watson Research Center Yorktown Heights, New York 10598, USA ）

Abstract：In this talk, I will introduce a novel multifunctional material, called a patternable low dielectric constant (low- κ) dielectric material, which dramatically reduces process complexity and enables a simple, low-cost, and “greener” way to wire the miniscule transistors in advanced semiconductor chips. A patternable low-κ dielectric material combines the functions of a traditional photoresist and a dielectric material into one single material. It acts as a traditional photoresist during patterning and is subsequently converted into a low-κ dielectric material during a post-patterning curing process. It eliminates the need for all sacrificial materials and their related deposition, pattern transfer (etch) and removal processes required in the traditional manufacturing flow. We have developed a patternable low-κ material that is compatible with the 248 nm optical lithography and possesses electrical and mechanical properties similar to those of an industry standard plasma enhanced chemical vapor deposition (PE CVD) deposited low-κ material. This κ =2.7 patternable low-κ material is based on a prevalent material platform and compatible with the current manufacturing infrastructure, thus easing a move toward mass adoption. We have also successfully demonstrated integration of this novel patternable low-κ dielectric material into advanced chips with very high electrical yields. This “proof-of-concept” demonstration of this simple, low-cost, “greener” patternable low-κ material technology is an important step toward preserving the historical pace of progress in the semiconductor industry.

About Speaker: Dr. Qinghuang Lin is a Research Staff Member at IBM Thomas J. Watson Research Center in Yorktown Heights, New York. He received his B.E. and M.S. degrees from Tsinghua University, Beijing, China and his Ph.D. degree from the University of Michigan—Ann Arbor. He was a post-doctoral fellow at the University of Texas at Austin prior to joining IBM. His current research interests center on novel nanomaterials for manufacturing of electronic devices and systems as well as solar cells. Dr. Lin is an IBM Master Inventor and has more than 50 issued and pending US patents. He is the editor or co-editor of 2 books and 4 conference proceedings volumes and the author and co-author of over 50 technical papers.