Dr.Qinghuang Lin from IBM Thomas J. Watson Research Center, headquarters for IBM Research Division paid a visit to the Institute of Semiconductors, Chinese Academy of sciences (IOS, CAS) on April 25, 2011 to conduct academic exchange.

During the visit, Dr. Qinghuang Lin gave a report at Huang Kun forum on Patternable Low-κ Dielectric Materials for “Greener” Semiconductor Manufacturing, claiming that this kind of material can dramatically reduce process complexity and enable a simple, low-cost, and “greener” way to wire the miniscule transistors in advanced semiconductor chips. He also introduced the technique of copper multilayer interconnection in integrated circuit chips as well as the function of photoresist involved in the technique.

The visit is expected to strengthen cooperation between CAS and IBM.