Organized by State Key Laboratory of Solid-State Lighting (in establishment)

Co-organizers:

·　　　　 Institute of Semiconductors (IOS), Chinese Academy of Science

·　　　　 Advanced Photoelectronic Technology Ltd

·　　　　 TU Delft-Beijing Research Centre, Delft University of Technology

Supported by:

Chinese SSL Alliance

Chairman:

Prof. Jinmin Li, President of Institute of Semiconductors (IOS), Chinese Academy of Science

Co-Chairman:

Prof. dr. C.I.M. Beenakker, Scientific director of Delft Institute of Microsystems and Nanoelectronics, Delft University of Technology (TU Delft), The Netherlands

Honorable Chairman:

Prof. K.Y. Bi, President of Chinese electronic packaging society and association

Organizing Committee Chairman:

·　　　　 R. Juan, deputy secretary general, Chinese Solid State Lighting Alliance (CSA)

·　　　　 G.W. Xiao, General Manager of Advanced Photoelectronic Technology Ltd

Executive Secretary:

·　　　　 Dr. Z. Liu , IOS, liuzhe@semi.ac.cn

·　　　　 Dr. L.B. Zhao, CSA,  zhaolb@china-led.net

·　　　　 Ms. D. Wu, APT,  wudi@apt-hk.com

Venue：Academic Conference Center，Institute of Semiconductors, CAS

Contacting Information:

·　　　　 Ms. Zhe Liu Tel: 82305247

·　　　　 Ms. Yankun Xu Tel:82304453

Program:

8:30 – 9:00 Registration

·　　　　 9:00-9:10

Welcome and chaired by Prof. J.M. Li

·　　　　 9:10 – 9:50

Ling Wu, International SSL Open Innovation Centre – Global Effort to Solve Global SSL Challenges

President of ISA and Secretary General of CSA

·　　　　 9:50 -10:30

Rolf Aschenbrenner, the State of the-Art of LED Packaging and System Integration,

President of IEEE CPMT society, Deputy Director of IZM institute/Fraunhofer, Germany, Rolf.Aschenbrenner@izm.fraunhofer.de

·　　　　 10:30 - 11:00

F.H. Yang, Optoelectronic Device Packaging in IOS

Professor and Director of Research Center for Semiconductor Integrated Technology, IOS, fhyang@semi.ac.cn

·　　　　 11:00 – 11:30

Dr. Wen-Yung Yeh, "Advanced Package Technology for Innovated LED Applications"

Director of LED division, Electronics & Optoelectronics Research Laboratories, Industrial Technology Research Institute, WenYungYeh@itri.org.tw

11:30 – 13:00 Lunch breaking

·　　　　 13:00 - 13:10

Welcome and chaired by Prof. dr. C.I.M. Beenakker

·　　　　 13:10 -13:40

X.J. Fan, Wafer Level Integration of LED System  

Prof. of Lamar University, USA, XUEJUN.FAN@lamar.edu

·　　　　 13:40 – 14:10

Gusung Kim, 3D TSV Interposer for LED Light Application

Founder of EPWorks, Professor of Kangnam Univ., Korea, gkim@epworks.co.kr

·　　　　 14:10 – 14:40

Barry Zhong, Lighting System Integration using HV Direct LED

LED Architect, Philips Lighting, barry.zhong@philips.com

14:40 – 15:00 Tea breaking

Welcome and chaired by Dr. R. Juan

·　　　　 15:00 – 15:30

Ryan Chung, The New Development of LED System Integration

Sr. Business Development Manager for LED Lighting, Astri, ryanchung@astri.org

·　　　　 15:30 – 16:00

G.W. Xiao, High Power LED Chip and Module Light Source Technology using Wafer Level Si Process

General Manager of Advanced Photoelectronic Technology Ltd, eegwxiao@apt-hk.com

·　　　　 16:00 – 16:30

G.Q. Zhang, Developing International Strategic Research Agenda for LED System Integration

Professor and director of DIMES Centre for SSL Technologies, g.q.zhang@tudelft.nl

·　　　　 16:30 – 17:30

Visiting IOS facilities (optional)