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  • International Seminar on “LED Packaging and System Integration”16-08-2011, Institute of Semiconductors, CAS Beijing, China
    Update time: 2011-07-27
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    Organized by State Key Laboratory of Solid-State Lighting (in establishment)


    ·     Institute of Semiconductors (IOS), Chinese Academy of Science

    ·     Advanced Photoelectronic Technology Ltd

    ·     TU Delft-Beijing Research Centre, Delft University of Technology

    Supported by:

    Chinese SSL Alliance


    Prof. Jinmin Li, President of Institute of Semiconductors (IOS), Chinese Academy of Science


    Prof. dr. C.I.M. Beenakker, Scientific director of Delft Institute of Microsystems and Nanoelectronics, Delft University of Technology (TU Delft), The Netherlands

    Honorable Chairman:

    Prof. K.Y. Bi, President of Chinese electronic packaging society and association

    Organizing Committee Chairman:

    ·     R. Juan, deputy secretary general, Chinese Solid State Lighting Alliance (CSA)

    ·     G.W. Xiao, General Manager of Advanced Photoelectronic Technology Ltd

    Executive Secretary:

    ·     Dr. Z. Liu , IOS, liuzhe@semi.ac.cn

    ·     Dr. L.B. Zhao, CSA,  zhaolb@china-led.net

    ·     Ms. D. Wu, APT,  wudi@apt-hk.com

    Venue:Academic Conference Center,Institute of Semiconductors, CAS

    Contacting Information:

    ·     Ms. Zhe Liu Tel: 82305247

    ·     Ms. Yankun Xu Tel:82304453


    8:30 – 9:00 Registration

    ·     9:00-9:10

    Welcome and chaired by Prof. J.M. Li

    ·     9:10 – 9:50

    Ling Wu, International SSL Open Innovation Centre – Global Effort to Solve Global SSL Challenges

    President of ISA and Secretary General of CSA

    ·     9:50 -10:30

    Rolf Aschenbrenner, the State of the-Art of LED Packaging and System Integration,

    President of IEEE CPMT society, Deputy Director of IZM institute/Fraunhofer, Germany, Rolf.Aschenbrenner@izm.fraunhofer.de

    ·     10:30 - 11:00

    F.H. Yang, Optoelectronic Device Packaging in IOS

    Professor and Director of Research Center for Semiconductor Integrated Technology, IOS, fhyang@semi.ac.cn

    ·     11:00 – 11:30

    Dr. Wen-Yung Yeh, "Advanced Package Technology for Innovated LED Applications"

    Director of LED division, Electronics & Optoelectronics Research Laboratories, Industrial Technology Research Institute, WenYungYeh@itri.org.tw

    11:30 – 13:00 Lunch breaking

    ·     13:00 - 13:10

    Welcome and chaired by Prof. dr. C.I.M. Beenakker

    ·     13:10 -13:40

    X.J. Fan, Wafer Level Integration of LED System  

    Prof. of Lamar University, USA, XUEJUN.FAN@lamar.edu

    ·     13:40 – 14:10

    Gusung Kim, 3D TSV Interposer for LED Light Application

    Founder of EPWorks, Professor of Kangnam Univ., Korea, gkim@epworks.co.kr

    ·     14:10 – 14:40

    Barry Zhong, Lighting System Integration using HV Direct LED

    LED Architect, Philips Lighting, barry.zhong@philips.com

    14:40 – 15:00 Tea breaking

    Welcome and chaired by Dr. R. Juan

    ·     15:00 – 15:30

    Ryan Chung, The New Development of LED System Integration

    Sr. Business Development Manager for LED Lighting, Astri, ryanchung@astri.org

    ·     15:30 – 16:00

    G.W. Xiao, High Power LED Chip and Module Light Source Technology using Wafer Level Si Process

    General Manager of Advanced Photoelectronic Technology Ltd, eegwxiao@apt-hk.com

    ·     16:00 – 16:30

    G.Q. Zhang, Developing International Strategic Research Agenda for LED System Integration

    Professor and director of DIMES Centre for SSL Technologies, g.q.zhang@tudelft.nl

    ·     16:30 – 17:30

    Visiting IOS facilities (optional)


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